Advanced Microelectronic Packaging and Fiber Optics Technologies for the Military, Defense & Security Industries ...

Plasma technology improves electronics manufacturing, reduces oxide layers without the use of flux, prevents delamination, improves adhesion and enables environmentally friendly, high performance ...

This paper studies board level reliability for surface mount devices during thermal cycling, while specifying failure modes and locations. Failure modes are characterized using thermal warpage and ...

A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding ...

Flexible, Automated Metrology Tool for the Fab The MicroProf® AP is a modular, optical metrology tool suited for HVM or for fabs requiring high flexibility on a wide range of applications. Camtek ...

LAB Flip Chip Reflow Process Robustness Prediction By Thermal Simulation ...

BGA component re-balling from lead-free to tin-lead solder is a requirement of some high reliability customer applications due to tin whisker concerns. This paper discusses the key process steps of ...

In situ hydrogen plasmas are critical for developing 3D chips with dense interconnects and high signal speeds. Atmospheric pressure hydrogen plasma offers a reliable, flux-free method for oxide ...

Ultrasonic die bonding revolutionizes semiconductor assembly with rapid processing, strong bonds, and low thermal stress. It excels in bonding dissimilar materials, advancing applications like power ...

The study highlights High-Density Fan-Out (HDFO) packages' fine copper redistribution layer (Cu RDL) reliability under electromigration (EM). Findings include distinct failure modes, resistance ...

For 30 years, Nidec SV Probe has been providing advanced testing solutions for a broad range of semiconductor devices, operating manufacturing and support sites worldwide in the USA, SEA, Europe, ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Cycle time optimized re-sorting or re-organization of ...