Microsoft introduces PC that has one job: connect users to their computers in the cloud: Summary Microsoft unveiled the Windows 365 Cloud Link, a lightweight PC aimed at corporate ...

Qualcomm Sets Up Smartphones for Agentic AI with Snapdragon 8 Elite: Summary Qualcomm unveiled the Snapdragon 8 Elite at its Snapdragon Summit, featuring second-gen Oryon CPUs wit ...

Samsung Electronics introduces 2nd-generation AI model, Gauss 2: Summary Samsung unveiled its Gauss2 AI model at the Samsung Developer Conference Korea 2024, showcasing enhanced p ...

Nvidia says it will sell more of its next-generation Blackwell chips than previously anticipated: Summary Nvidia’s new Blackwell AI chips are in high demand, with 13,000 units s ...

China races to stockpile US chips before Trump ramps up sanctions: Summary China is ramping up US microchip imports, stockpiling $1.11 billion in October, a 60% year-over-year sur ...

The National Institute of Standards and Technology will fund ASU and Deca Technologies up to $100M for SHIELD USA, advancing U.S. microchip packaging. This initiative boosts innovation, reshoring ...

Summary The EDA industry remains highly competitive, with major players like Cadence and Synopsys dominating 90% of the market through internal innovation and AI/ML integration. Despite fewer startups ...

Summary Chip design has evolved drastically since 1971, yet modern tools often fail to tackle its staggering complexity. Intel's team devel ...

High-bandwidth memory (HBM) sales are surging as AI accelerators and HPC applications demand faster data processing. Innovations like custom HBM and advancements in packaging, 3D stacking, and ...

Summary Fan-Out Panel-Level Packaging (FOPLP) is emerging as a scalable, cost-effective solution for advanced nodes, balancing high integration densities with manufacturability. Despite challenges ...

Summary Device design starts by defining its workload and available resources. Early decisions shape physical architecture, with tools like Synopsys’s Platform Architect aiding integration planning.

SK hynix has commenced mass production of the world’s first 321-layer triple-level cell NAND flash memory chips. Building on its 238-layer success, the company aims to lead AI storage markets, ...