Sondrel, a leading provider of ultra-complex custom chips, has announced that it has started front end, RTL design and ...

Semiconductor veterans secure $3.7M seed funding to launch a universal RISC-V processor that eliminates the need for ...

HBM implementation challenges This is the second in a three-part series from Alphawave Semi on HBM4 and gives insights into ...

Frontgrade Gaisler has launched its latest radiation-hardened microcontroller, the GR716B. Building on the success of the ...

Traditional interconnects have been unable to deliver the bandwidth, latency, and power efficiency needs of hyperscale data ...

Eliyan uses its NuLink technology to develop die-to-die PHY IP products to support multiple standards (including UCIe and BoW) and multiple packaging types (including advanced packaging and standard ...

Panmnesia, a South Korean fabless CXL startup, announced that it has successfully secured over $60M in Series A funding.

Cadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system ...

System-on-chip (SoC) designers face significant challenges when integrating thousands of IP blocks from various vendors, ...

TSMC is looking to introduce its A16 1.6nm process by the end of 2026 with an IEEE standard for its 3Dblox technology.

FlexNoC 5 interconnect IP with physical awareness improves place and route efficiency and reduces interconnect area and power ...

Xiphera’s board of five includes company’s co-founders and three other people from different backgrounds. The new board is filled with new kind of ...