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4 天
苹果从iPhone 18 Pro开始将弃用高通5G芯片
为了开发能够替代高通的产品,苹果公司在全球范围内投入了数十亿美元,建立了多个测试和工程实验室,并斥资约10亿美元收购了英特尔的一个相关部门。经过不懈努力,苹果的自研5G基带芯片预计将于明年正式推出。然而,据称Sinope将仅支持四载波聚合,并不具备5G毫米波功能,相比之下,高通的产品能同时支持六个或更多载波。
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