Technology Co-Optimization for Dense Edge Architectures using 3D Integration and Non-Volatile Memory” was published by ...

Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions” was ...

Pooling CPU Memory for LLM Inference” was published by researchers at UC Berkeley. Abstract “The rapid growth of LLMs has ...

Where digital and analog designs are overlapping, and why it's becoming more difficult to ensure they work as expected over ...

A technical paper titled “Detection of defective chips from nanostructures with a high-aspect ratio using hyperspectral ...

A new technical paper titled “Exploring GAA-Nanosheet, Forksheet and GAA-Forksheet Architectures: a TCAD-DTCO Study at 90 nm & 120 nm Cell Height” was published by imec, Huawei Technologies and Global ...

The semiconductor industry is rapidly evolving, and as we look towards 2025, chiplets are at the forefront of this transformation. The shift from traditional monolithic system-on-chip (SoC) designs to ...

While the long-term future of mobile connectivity is bright, there are still short-term challenges to face.