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OFweek维科网
20 分钟
英伟达GB200跳票!科技产品频繁「难产」,技术大山难以跨越
但现实告诉我们——GB200 难产了。消息称,GB200 在制造阶段遇到了「硬骨头」:裸晶连接设计存在缺陷,直接影响芯片的良率和性能。此外,散热和高功耗问题同样让人头大——顶级芯片带来的不仅是性能巅峰,还有一系列难以规避的工程挑战。
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