Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. Its good fluidity enables it to flow at 20°C into ...

High Production Costs: The significant energy required for manufacturing high-temperature composite resins and the costs associated with raw materials can impact market growth. Economic Instability: ...

Description: It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12 hours. After ...

The EP30-2 cures readily in 24-48 hours at room temperature or more quickly at higher temperatures ... It is an extremely structural system, meaning it is rigid without being brittle. The epoxy system ...