Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. Its good fluidity enables it to flow at 20°C into ...

Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection ...

Master Bond Supreme 17HTND-2 is a toughened epoxy system for bonding and sealing applications. It is a true one component system, not premixed and frozen, with an unlimited working life at room ...

High Production Costs: The significant energy required for manufacturing high-temperature composite resins and the costs associated with raw materials can impact market growth. Economic Instability: ...

Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively ... strength of 24,000-26,000 psi, an ultra-high modulus of more than 1,000,000 ...

The EP30-2 cures readily in 24-48 hours at room temperature or more quickly at higher temperatures ... It is an extremely structural system, meaning it is rigid without being brittle. The epoxy system ...