New TPU; TSMC revenue, export investigation; global semi equipment sales; 2D materials roadmap; acquisitions; UALink spec; EU ...

Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

Boot-up and software deployment in distributed, synchronized multi-processor systems that integrate additional accelerators.

The AI Readiness Index Report provides a valuable benchmark against which organizations can measure their AI maturity. For ...

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...

PCIe 6, released in January 2022, introduced a data transfer rate of 64 GT/s (gigatransfers per second), double that of its ...

Activation functions play a critical role in AI inference, helping to ferret out nonlinear behaviors in AI models. This makes ...

Maintaining the quality and reliability of electrical signals as they travel through interconnects is proving to be much more challenging with chiplets and advanced packaging than in monolithic SoCs ...

Controlling film thickness to precise specifications is essential for ensuring high yield in high-performance devices.

The impact of embedded micro-bumps and wafer-to-wafer hybrid bonding on the thermal behavior of the package stack.

A new technical paper titled “The 2D Materials Roadmap” was published by researchers at many institutions including Chinese ...

Xtreme Pooling allows any test processor on a Pin Scale 5000 card to store vector data in other test processors’ ...