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Semiconductor Engineering
6 小时
Pooling CPU Memory for LLM Inference With Lower Latency and Higher Throughput (UC Berkeley)
Pooling CPU Memory for LLM Inference” was published by researchers at UC Berkeley. Abstract “The rapid growth of LLMs has ...
Semiconductor Engineering
6 小时
Aging, Complexity, And AI In Analog Design
Where digital and analog designs are overlapping, and why it's becoming more difficult to ensure they work as expected over ...
Semiconductor Engineering
12 小时
Monitor Etch Defects on Dies in the Outer Regions Of The Wafer Using ISR
A technical paper titled “Detection of defective chips from nanostructures with a high-aspect ratio using hyperspectral ...
Semiconductor Engineering
1 天
Slow Progress On Generative EDA
The dream may be to have generative AI write RTL, but text is only one of the necessary things AI must understand to help ...
Semiconductor Engineering
1 天
Top-Down Vs. Bottom-Up Chiplet Design
Third-party chiplets are hitting the market as chiplet models evolve. Who's calling the shots isn't clear yet.
Semiconductor Engineering
1 天
Critical Design Considerations For High-Bandwidth Chiplet Interconnects (TSMC)
A new technical paper titled “High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: ...
Semiconductor Engineering
1 天
How AI Is Transforming System Design
LLMs and machine learning are automating expertise in an aging workforce.
Semiconductor Engineering
1 天
Redefining XPU Memory For AI Data Centers Through Custom HBM4: Part 1
Despite its cost and complexity, HBM offers significant advantages when performance and bandwidth are critical.
Semiconductor Engineering
1 天
Successful Design Of Power Management Chips
The Synopsys Custom Design flow provides unique benefits for power electronics designers, and the close collaboration with ...
Semiconductor Engineering
1 天
Goal-Driven AI
Any optimization problem must have a clear, unambiguous specification and a way to define the goodness of the solution. Today ...
Semiconductor Engineering
1 天
The Latest Wireless Industry Use Cases
While the long-term future of mobile connectivity is bright, there are still short-term challenges to face.
Semiconductor Engineering
1 天
Backpropagation Algorithm On Neuromorphic Spiking HW (U. Of Zurich, ETH Zurich, LANL)
A new technical paper titled “The backpropagation algorithm implemented on spiking neuromorphic hardware” was published by ...
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