Vishay Intertechnology's D2TO35M automotive grade surface-mount thick film power resistor combines multi-pulse capabilities with high power dissipation of 35W at 25°C. Is said to provide higher power ...
AHMEDABAD, INDIA – Aimtron Electronics has announced the opening of its US-based subsidiary on Jan. 1.
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer praising finalization of semiconductor manufacturing investments announced ...
SEOUL, KOREA – Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, is proud to announce that Foxconn honored us on November 15, 2024, with its prestigious. This ...
We are honored to partner with the highly respected D-Orbit Group as they enter the U.S. market,” said Jeff Gilbert, CEO of Spectrum. “Spectrum and D-Orbit share the same values of dedication to our ...
Both companies are experiencing rapid growth, and PTEC Solutions has plans to expand operations by adding additional square footage at their Morgan Hill location, complementing their established ...
BANNOCKBURN, IL – The electronics industry faced a mixed sentiment in November, with modest improvements in demand overshadowed by rising cost pressures according to IPC’s November Sentiment of the ...
WASHINGTON – The Semiconductor Industry Association (SIA) today announced Western Digital CEO David Goeckeler has been elected Chair of the SIA Board of Directors. SIA represents 99% of the U.S.
SAN JOSE, CA – Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, has further elevated its quality assurance capabilities with the installation of the ...
BANNOCKBURN, IL – North American EMS shipments in October were up 14.7% compared to the same month last year, IPC reported in findings from its North American EMS Statistical Program. The book-to-bill ...
Shenmao's PF606-P lead-free solder paste is designed specifically for the reverse hybrid assembly process, which uses SAC solder paste and BGA components with LTS balls.