台积电推出“超大版”CoWoS封装，达9个掩模尺寸
台积电11月欧洲开放创新平台（OIP）论坛上宣布，该公司有望在2027年认证其超大版本的CoWoS（晶圆上芯片）封装技术，该技术将提供高达9个掩模尺寸的中介层尺寸和12个HBM4内存堆栈。新的封装方法将解决性能要求最高的应用，并让AI（人工智能）和H ...
Yahoo23 天
TSMC Will Keep 2nm Chip Production in Taiwan (For Now)
Taiwan Semiconductor Manufacturing Co (TSMC) can’t produce 2nm chips outside of Tawain, according to J.W. Kuo, the country's Minister of Economic Affairs. The Arizona fab 21 is still on track to ...
heise online2 天
From 2028: TSMC hopes to produce 2nm SoCs in the US sooner
The Taiwanese chip manufacturer is known to be building in Arizona, but the latest chips are still being produced at home.
The Register on MSN5 天
TSMC bets big on 2nm by 2025 – but can it deliver?
Ambition meets reality as geopolitical, technical, and logistical challenges loom analysis Over the last couple of weeks, ...
新浪网23 天
台积电暂不能在海外生产2nm芯片，以确保先进半导体工艺技术留在当地
前一段时间，台积电（TSMC）董事长兼首席执行官魏哲家表示，客户对于2nm的询问多于3nm，看起来更受客户的欢迎，未来五年内台积电有望实现连续 ...
Arizona chip plants could make 2nm chips from 2028, claims TSMC
Things haven’t exactly been going to plan with TSMC’s Arizona chip plants, but the company is claiming that the ...
台积电美国晶圆厂扩大学徒计划
当地时间本月19日，台积电美国晶圆厂运营子公司TSMC Arizona、亚利桑那州州长以及菲尼克斯市长共同宣布，将TSMC Arizona的美国学徒计划扩展至更多岗位。 据了解，TSMC ...
苹果要首发！台积电宣布2nm已准备就绪
台积电宣布2nm芯片设计平台就绪，计划2025年末量产N2工艺，2026年末投产A16工艺。A16将采用超级电轨架构。苹果或成首批2nm制程应用者，iPhone18Pro系列望首批搭载。2nm技术代表半导体制造新高度。